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Spansion Introduces Innovative Package-On-Package Solution To Reduce Wireless Device Size
Spansion’s Solution Reduces Form Factors as Devices Adopt New Features
Sunnyvale, Calif., -- September 12, 2005 --Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702), today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion’s new PoP solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. As a result, handset manufacturers can accommodate the growing demand for advanced features in their wireless products without having to increase their size and weight.
Technical Features
Spansion has the capability of delivering 8-die solutions in a 128-ball, 12 x 12 mm package with a 0.65 mm pitch. PoP’s short trace lengths and low bus capacitance also help to overcome the signal integrity and timing issues associated with emerging 133 MHz dual-data rate (DDR) memory solutions(tzv. DDR266 oficialne PC2100 t.j. prenosova rychlost 2100 MB/s half duplex). Spansion’s approach reduces pin-count and eliminates printed-circuit board (PCB) routing between logic and memory, for reduced design complexity.
Spansion’s PoP solutions include the inherent benefits of its advanced two-bit-per-cell MirrorBit™ technology, including the right combination of reliability, cost, performance and density. With the future availability of the ORNAND™ architecture, Spansion plans to extend the benefits of MirrorBit technology and believes it will be able to respond to the demand for mass storage solutions in wireless handsets and complement application processors with an optimized code and data storage solution.